DSpace About DSpace Software
 

Makerere University Research Repository >
Faculty of Forestry and Nature Conservation >
Conference and Workshop Reports (Forestry) >

Please use this identifier to cite or link to this item: http://hdl.handle.net/123456789/1866

Title: Strength Characterisation of Timbers for Building Construction in Uganda
Authors: Zziwa, Ahamada
Ziraba, Yasin Naku
Mwakali, Jackson A.
Keywords: Building
Construction
Standards
Strength class
Timber
Issue Date: 2011
Publisher: Macmillan Uganda
Abstract: Lack of local Uganda timber standards formed the basis of the study. The specific objectives were to determine strength properties of selected timbers; develop a strength class system; and develop a non-destructive timber testing approach. Strength tests were conducted in bending, compression and shear parallel to grain following procedures of American Society for Testing and Materials (ASTM), ISO 8905 1988(E), AS/NZS 2878 (2000)and BS 373 (1957). The allowable Modulus of rupture (MOR) varied from 3.9 N/mm2 to 20.3 N/mm2; the mean Modulus of Elasticity (MOE) varied from 5,760 N/mm2 to 13,440 N/mm2; shear parallel to grain varied from 7.2 N/mm2 to 13 N/mm2; compression parallel to grain varied from 20 N/mm2 to 59 N/mm2 and density varied from 322 Kg/m3 to 595 Kg/m3. Four timber strength classes: SG4, SG8, SG12 and SG16 were developed. It was concluded that MOE and MOR of structural timber can be estimated from small clear MOE and MOR using reduction factors of 40% and 20% respectively. It was also concluded that a number of lesser-known timbers have strength properties comparable to those of well-known timbers. There is need to develop timber standards for Uganda.
URI: http://hdl.handle.net/123456789/1866
ISBN: 978-9970-214-00-7
Appears in Collections:Conference and Workshop Reports (Forestry)

Files in This Item:

File Description SizeFormat
Zziwa.pdf329KbAdobe PDFView/Open

All items in DSpace are protected by copyright, with all rights reserved.

 

Valid XHTML 1.0! DSpace Software Copyright © 2002-2005 MIT and Hewlett-Packard - Feedback